Materialographic Preparation and Evaluation of Microelectronic Devices

​Difficulty preparing materialographic samples of microelectronic devices? Watch and learn as we discuss Struers’ proven solutions.

Microelectronic components present a unique challenge for materialographic preparation. In microelectronic components, various materials with widely differing properties are packaged together (glass, ceramics, metals, and polymers), so preparing all materials well can be difficult. Additional complications arise from the small size, complex geometry, and need for controlled material removal to reach a plane of interest. Please join us as we discuss Struers’ solutions for preparing microelectronic devices.

In this webinar attendees will learn about:

Challenging clamping of complex and small samples
Vacuum impregnation to fill vias with epoxy resin
Controlled material removal to reach a plane of interest
Excellent scratch-free preparation of materials with varying properties