Dedicated solutions are often used, but experience also shows that overcoming a challenge in one application will give inspiration to the solution of a similar challenge in another application.
Components in miniature dimension, complex material compositions, and very specific points of interest for the examination characterizes materialography on microelectronics. Controlled material removal in dedicated equipment and accessories is used in this application combined with conventional principles for the materialographic processes: cutting, mounting, grinding, and polishing.
Construction parts or large components that are not easily accessible or movable, and have to be intact after testing is materialographically tested on-site. Special copy and replica techniques and specialized products allow for microstructure examination without cutting out a sample.
Applying materialography on samples with natural variety and multiple compositions is manageable with a structured approach to the selection of the preparation method. Building up practical skills in this special application can be supplemented with automated and reproducible products and methods.
Preparation of a small ultra-thin specimen accessible for electrons and complete free of effects from any mechanical impact is a special materialographic challenge. Electropolishing in dedicated equipment is the solution suitable to solve this task.
